Laboratory, optical and precision equipments (excl. glasses)

Tender description

Tenders are sought for the supply, delivery and installation of a plasma chemical vapour deposition system for compound semiconductors for the Tyndall National Institute, UCC. Tenders are sought for the supply, delivery and installation of a plasma chemical vapour deposition system for compound semiconductors for the Tyndall National Institute, UCC. The Process and Product Development laboratories at Tyndall National Institute, UCC, fabricate a wide variety of semiconductor devices, ranging from traditional silicon microelectronics and Silicon MEMS to III-V photonic devices. We wish to extend our capability in the area of plasma deposition by purchasing a fully functional load locked PECVD (Plasma Enhanced Chemical Vapour Deposition) or ICPCVD (Inductively Coupled Plasma Chemical Vapour Deposition) system including pumps which will allow us to move our processing to a higher TRL level in terms of substrate size, deposition processes and control. The system offered must be suitable for use in a class 1 000 cleanroom. As much of the work is in the area of semiconductor R&D we have a requirement for a system that can handle substrates of varying sizes from 10 x 10 mm and various irregular shaped pieces through to 200 mm wafers, including 50 mm, 100 mm and 150 mm wafers. Due to the novel nature of the R&D and customer base we also require that the system be able to deposit a variety of film materials from dielectrics SiO2 (silicon dioxide), Si3N4 (silicon nitride) and SiOxNy (silicon oxynitride) to amorphous silicon and SiC (silicon carbide). We have defined the technical specification in terms of these specific film materials and also for the use of TEOS (Tetraethylorthosilicate) liquid precursor for conformal SiO2 deposition and the specific requirement for low temperature deposition of SiO2 and Si3N4 as well as these materials at the more standard deposition temperature of 300 C. The tenderer should also supply as part of the tender response details of the recipes to be used for cleaning when changing between deposition materials. The tender response must clearly show the costs for all items and any additional options must be clearly identified as such and costed separately. As part of