Closed tender

Die Bonding System

Details

Value
GBP 215,000
Topic
Laboratory, optical and precision equipments (excl. glasses)
Published
1 July 2026
Submission
16 July 2026

Tender description

Funding is available to purchase a die attach/bonding system capable of performing a wide range of bonding processes, including ultrasonic, flip-chip, and UV curing, which is suitable for prototyping and light production runs. As a result, a crucial aspect for any die attach system under is the ability to be used for bonding runs as small as a single die should this be required. This stipulation lends itself to a semi-automated (i.e. motorised) system, ideally with the capacity to store process recipes to maximise reproducibility should the system be used for light production runs.

Timeline

  1. Completed: Tender published1 July 2026
    Current notice
  2. Completed: Submission date16 July 2026

About the buyer

University of Bristol is a public sector buyer in United Kingdom publishing tenders and awards on Stotles. Explore their procurement activity and find more opportunities like this one.

Relevant CPV codes

  • 38000000 · Laboratory, optical and precision equipments (excl. glasses)

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