PURCH2864 Provision of Contract Agreement for the Provision of Copper Electroplating Tool

Tender description

PURCH2864 Provision of Contract Agreement for the Provision of Copper Electroplating Tool for a minimum period of 12 months with the option to extend for two further periods of up to 12 months. Tender documents available from Public Contracts Scotland. Tender returns should be submitted via Public Contracts Scotland, no paper copies will be accepted. Should paper tenders be submitted, they will be rejected. Further to this any questions or communications regarding individual tender exercises must be sent via the Public Contracts Scotland Portal. Tender queries received through any other channel will not be answered. Should users of Public Contracts Scotland have any problems with the web site they should contact website Support Desk, contact details can be found by following the ‘Contact Us’ option on the left hand menu at http://www.publiccontractsscotland.gov.uk/default.aspx Lot 1: PURCH2864 Provision of Contract Agreement for the Provision of Copper Electroplating Tool for a minimum period of 12 months with the option to extend for two further periods of up to 12 months. This procurement process is being conducted using the Competitive Procedure with Negotiation (CPN) in accordance with the requirements of Regulation 30 of the PC(S)R 2015. Although this procurement is being conducted under the Competitive Procedure with Negotiation (CPN), it is structured differently from a typical CPN process. This approach has been adopted to enhance the efficiency of evaluating supplier responses across both stages (SPD and ITT). The electroplating system shall be a fully enclosed, floor-standing tool designed for electrolytic copper deposition on 200 mm wafers for R&D and pilot-scale manufacturing. It shall provide programmable control of key process parameters including current, voltage, waveform, wafer rotation, bath temperature and electrolyte flow, enabling precise tuning of deposition conditions. The system shall support DC and pulse/pulse-reverse plating modes for copper films and be constructed entirely from FM-4910-compliant materials, suitable for installation in a cleanroom environment. Please refer to PURCH2864 - Schedule 1A - Invitation to Tender for specification.