Stale Pre-tender

Sub-Micron Die Bonder

Details

Buyer
University of Sheffield
Value
GBP 380,000
Topic
Laboratory, optical and precision equipments (excl. glasses)
Published
9 December 2025
Submission
26 November 2025
Source
uk:find_a_tender

Tender description

We are seeking equipment that can provide a wide range of bonding technologies to cater for semiconductor die to wafer, die to chip, wafer to wafer, fli-chip and other semiconductor chiplet bonding, to support our work in Heterogeneous Integration for Microelectronics and Semiconductor Systems.

Timeline

  1. Pre-tender published9 December 2025
    Current notice

About the buyer

University of Sheffield is a public sector buyer in United Kingdom publishing tenders and awards on Stotles. Explore their procurement activity and find more opportunities like this one.

Relevant CPV codes

  • 38000000 · Laboratory, optical and precision equipments (excl. glasses)

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Decision makers

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