Wafer Thinning for The National Manufacturing Institute of Scotland (NMIS)

Tender description

NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. This procurement campaign focuses on the turnkey supply of a wafer laminator, wafer back grinding, wafer polishing and wafer cleaning capability. Estimated value range GBP1.2m-GBP2m Lot 1: NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is able to support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The items procured will enable NMIS to set up a research facility for developing and scaling-up advanced packaging capabilities for power electronic semiconductors. The overall facility will have capability to prepare, thin, dice/cut, bond, interconnect, package and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The focus will be procuring equipment as a turnkey to support, wafer back grinding, wafer polishing, and wafer cleaning. The capability will allow rough and fine dry polishing as well as rough and fine Chemical Mechanical Polishing. This will also include the requirement for ancillary equipment to provide services to these processes, including but not limited to water. The cleanroom facility has a limited water supply and waste water capability and so closed loop systems are preferred wherever possible. The necessary services of Electrical power, CDA and Nitrogen will be available, and plant to provide these services is not in scope for this procurement activity. Wherever necessary, suitable sources of vacuum should be included.