Closed tender
UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components
Details
- Buyer
- BiP SOlutions
- Value
- GBP 1
- Topic
- Microelectronic machinery and apparatus and microsystems
- Published
- 21 February 2024
- Submission
- 19 January 2024
- Source
- uk:contracts_finder
Tender description
UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) wishes to establish a Contract for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic Components.
Timeline
- Completed: Submission date19 January 2024
- Completed: Tender published21 February 2024Current notice
About the buyer
BiP SOlutions is a public sector buyer in United Kingdom publishing tenders and awards on Stotles. Explore their procurement activity and find more opportunities like this one.
Relevant CPV codes
- 31712000 · Microelectronic machinery and apparatus and microsystems
Decision makers
Connect with the people behind this procurement.
| Contact name | Job title | Phone number | Work email |
|---|---|---|---|
| Head of Procurement | +44 •••• •••••• | ••••••••@bip-solutions.gov | |
| Commercial Director | +44 •••• •••••• | ••••••••@bip-solutions.gov | |
| Procurement Manager | +44 •••• •••••• | ••••••••@bip-solutions.gov | |
| Category Lead | +44 •••• •••••• | ••••••••@bip-solutions.gov | |
| Senior Buyer | +44 •••• •••••• | ••••••••@bip-solutions.gov | |
| Contracts Manager | +44 •••• •••••• | ••••••••@bip-solutions.gov |
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