Awarded contract

UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components

Details

Buyer: UK Research & Innovation
Supplier(s): Inseto
Value: GBP 250,000
Topic: Microelectronic machinery and apparatus and microsystems
Published: 15 February 2024
Source: uk:find_a_tender

Tender description

UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) had a requirement for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic. Lot 1: UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) had a requirement for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic.

Timeline

Completed: Award date13 February 2024
Completed: Award published15 February 2024
Current notice

About the buyer

UK Research & Innovation is a public sector buyer in United Kingdom publishing tenders and awards on Stotles. Explore their procurement activity and find more opportunities like this one.

Relevant CPV codes

31712000 · Microelectronic machinery and apparatus and microsystems

Decision makers

Connect with the people behind this procurement.

Job title	Phone number	Work email
Head of Procurement	+44 •••• ••••••	••••••••@uk-research-innovation.gov
Commercial Director	+44 •••• ••••••	••••••••@uk-research-innovation.gov
Procurement Manager	+44 •••• ••••••	••••••••@uk-research-innovation.gov
Category Lead	+44 •••• ••••••	••••••••@uk-research-innovation.gov
Senior Buyer	+44 •••• ••••••	••••••••@uk-research-innovation.gov
Contracts Manager	+44 •••• ••••••	••••••••@uk-research-innovation.gov