Chip Cleave & Break system

Tender description

The ICS has a requirement for a Chip Cleave and Break tool for application with Electronic and Optoelectronic devices on a range of material platforms including Si-Photonics integrated with compound semiconductor chips, III-V material laser diode cleaving resulting in high quality mirror facets, bar to die separation and die singulation. The tool must be capable of automatic processing or manual mode operation, must be capable of handling up to 150mm wafers at least as well as small pieces or tiles of a wafer and must be compatible with subsequent process steps and tooling such as a Pick and Place tool Lot 1: The ICS has a requirement for a Chip Cleave and Break tool for application with Electronic and Optoelectronic devices on a range of material platforms including Si-Photonics integrated with compound semiconductor chips, III-V material laser diode cleaving resulting in high quality mirror facets, bar to die separation and die singulation. The tool must be capable of automatic processing or manual mode operation, must be capable of handling up to 150mm wafers at least as well as small pieces or tiles of a wafer and must be compatible with subsequent process steps and tooling such as a Pick and Place tool