Provision of a dedicated 3D measurement, inspection and metrology system.

Tender description

NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support a 3D Scanning, Inspection and Metrology capability along with any and all associated ancillaries required. NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The items procured will enable NMIS to set up a research facility for developing and scaling-up advanced packaging capabilities for power electronic semiconductors. The overall facility will have capability to prepare, dice/cut, bond, interconnect, package, and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The focus of this procurement process will be procuring equipment to provide a 3D Scanning, Inspection and Metrology capability along with any and all associated ancillaries required. The University is seeking a supplier to supply, deliver, install, and commission the equipment, and provide training in its proper use. We expect to purchase a piece of equipment that will give us the ability to conduct in depth 3D dimensional inspection on all aspects of goods at ‘goods-in receipt’ and ‘in process’, and allow automated inspection of pre-diced wafers. We expect to be able to measure features in the range 10 to 2000 microns, on 12 inch diameter wafers and components ranging in size from 2mm to 400mm.