904 - Compound Semiconductor Plasma Processing Equipment

Tender description

The College of Engineering and Physical Sciences (EPS) at Aston university is creating a III-V semiconductor fabrication facility. As a consequence, we are seeking a single supplier to provide a suite of plasma processing tools for: • ICP Etch of semiconductor materials (e.g. GaAs, GaN, InP, GaSb) • RIE Etch of dielectric materials (e.g. SiO2, SiNx) and metals (e.g. Au, Ge, Cr, Ti, Pt, Pd) • Deposition of dielectric layers (e.g. SiO2, SiNx) The full project specific requirements and equipment specification can be found within the project question set on Aston University’s e-tendering portal ProContract under Section 11 – Project Specific Requirements. Lot 1: The College of Engineering and Physical Sciences (EPS) at Aston university is creating a III-V semiconductor fabrication facility. As a consequence, we are seeking a single supplier to provide a suite of plasma processing tools for: • ICP Etch of semiconductor materials (e.g. GaAs, GaN, InP, GaSb) • RIE Etch of dielectric materials (e.g. SiO2, SiNx) and metals (e.g. Au, Ge, Cr, Ti, Pt, Pd) • Deposition of dielectric layers (e.g. SiO2, SiNx) The full project specific requirements and equipment specification can be found within the project question set on Aston University’s e-tendering portal ProContract under Section 11 – Project Specific Requirements.