Closed tender
Wafer Dicing Saw
Details
- Value
- GBP 67,000
- Topic
- Sawing equipment
- Published
- 12 April 2023
- Submission
- 26 April 2023
Tender description
Tenders should demonstrate that the supplier possesses a comprehensive process library and clearly show the ability to cut glass, quartz, sapphire, silicon and SiC substrates. Tenders should address how a 1 mm thick, 150 mm square glass substrates can be diced.
Timeline
- Completed: Tender published12 April 2023Current notice
- Completed: Submission date26 April 2023
About the buyer
University of St Andrews is a public sector buyer in United Kingdom publishing tenders and awards on Stotles. Explore their procurement activity and find more opportunities like this one.
Relevant CPV codes
- 43812000 · Sawing equipment
Decision makers
Connect with the people behind this procurement.
| Contact name | Job title | Phone number | Work email |
|---|---|---|---|
| Head of Procurement | +44 •••• •••••• | ••••••••@university-of-st-andrews.gov | |
| Commercial Director | +44 •••• •••••• | ••••••••@university-of-st-andrews.gov | |
| Procurement Manager | +44 •••• •••••• | ••••••••@university-of-st-andrews.gov | |
| Category Lead | +44 •••• •••••• | ••••••••@university-of-st-andrews.gov | |
| Senior Buyer | +44 •••• •••••• | ••••••••@university-of-st-andrews.gov | |
| Contracts Manager | +44 •••• •••••• | ••••••••@university-of-st-andrews.gov |
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