Micro Transfer Printing System

Tender description

The EPSRC National Epitaxy Facility (NEF) at the University of Sheffield supplies a wide range of III-V semiconductor materials and devices primarily to the UK academic research community. The NEF also engages in significant activity researching and developing new materials and structures. A key direction in this area is the heterogeneous integration of III-V and silicon based photonic and opto-electronic devices. For this purpose the NEF requires a full, turn-key micro transfer printing (MTP) system suitable for highly-accurate, large-scale, parallel transfer of devices from a source wafer to a target wafer. This system must meet all the essential technical requirements set out within the tender documents Lot 1: It is essential that the tool is easily configured to accommodate all standard wafer sizes up to 6 inch, and that the placement accuracy is +/- 2μm or better. The system must also come with at least 3 application-specific stamps. These can be collaboratively developed with NEF staff once the order for the tool is placed. Technical capabilities that extend beyond the minimum essential specifications would be welcomed where possible. Of particular interest is training and support to enable the EPSRC NEF to produce their own custom-designed application-specific stamps. Higher level of automation of the process is also desirable, including automatic cleaning of stamps and alignment of source and target patterns during transfer-printing.