Awarded contract

Lapping and Polishing Machine

Details

Supplier(s)
Logitech Ltd
Value
GBP 197,056.8
Topic
Laboratory, optical and precision equipments (excl. glasses)
Published
30 October 2022
Source
eu:ted

Tender description

A lapping and polishing machine capable of thin wafers up to 200mm in diameter Lot 1: Cardiff University is looking for a new lapping and polishing tool to thin wafers up to 200mm in diameter in a variety of materials such as Gallium Arsenide, Indium Phosphide, silicon, and silicon carbide. The University encourages bids from suppliers that have experience of supplying lapping and polishing machines to organisations of a similar nature in the UK preferably or Europe within the last 2 years, bidders must have supplied at least 5 units in the last 2 years.

Timeline

  1. Completed: Award published30 October 2022
    Current notice
  2. Completed: Award date30 October 2022

About the buyer

Cardiff University is a public sector buyer in United Kingdom publishing tenders and awards on Stotles. Explore their procurement activity and find more opportunities like this one.

Relevant CPV codes

  • 38000000 · Laboratory, optical and precision equipments (excl. glasses)

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Decision makers

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