Awarded contract

Optical Fiber Array and Micro-lens Packaging Equipment

Details

Topic
Microelectronic machinery and apparatus and microsystems
Published
3 May 2022

Tender description

The photonic Packaging Group and the Tyndall Institute is seeking to purchase equipment to package optical components, specifically optical fibre and micro-optical components to photonic devices such as Photonic Integrated Circuits (PICs). These PIC devices include Silicon (Si), Indium Phosphide (InP) and Silicon Nitride (SiN) type photonic devices.

Timeline

  1. Completed: Award published3 May 2022
    Current notice
  2. Completed: Award date3 May 2022

About the buyer

University College Cork (UCC) is a public sector buyer in Ireland publishing tenders and awards on Stotles. Explore their procurement activity and find more opportunities like this one.

Relevant CPV codes

  • 31712000 · Microelectronic machinery and apparatus and microsystems
  • 31712100 · Microelectronic machinery and apparatus
  • 38000000 · Laboratory, optical and precision equipments (excl. glasses)
  • 42921320 · Packaging machines

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Decision makers

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