Awarded contract

Supply of Semiconductor Dicing and Grinding Systems

Details

Buyer
Swansea University
Supplier(s)
Disco HI-TEC UK LTD
Value
350,000
Topic
Laboratory, optical and precision equipments (excl. glasses)
Published
8 November 2021
Source
uk:sell2wales

Tender description

This Tender Specification is for the supply and installation of a Wafer Dicing System and a Wafer Grinding System. These systems will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be conducted within the facility. This requirement is split into two separate lots Lot 1: Wafer Dicing System This Tender Specification is for the supply and installation of a Wafer Dicing System and a Wafer Grinding System. These systems will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be conducted within the facility. Lot 2: Wafer Grinding System This procurement is for the supply and installation of a Wafer Grinding System. This will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be conducted within the facility.

Timeline

  1. Award date19 October 2021
  2. Award published8 November 2021
    Current notice

About the buyer

Swansea University is a public sector buyer in United Kingdom publishing tenders and awards on Stotles. Explore their procurement activity and find more opportunities like this one.

Relevant CPV codes

  • 38000000 · Laboratory, optical and precision equipments (excl. glasses)

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Decision makers

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