Closed tender

Supply of a Wafer Cleaving System

Details

Topic
Laboratory, optical and precision equipments (excl. glasses)
Published
22 October 2021
Submission
8 November 2021

Tender description

This Tender is for the supply and installation of a wafer cleaving system. This system will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be conducted within the facility. Funding for this procurement has been secured from the Application Specific Semiconductor Etching Technology (ASSET) project via the Welsh Government’s SMARTExpertise Program, which is funded through the European Regional Development Fund (ERDF).

Timeline

  1. Completed: Tender published22 October 2021
    Current notice
  2. Completed: Submission date8 November 2021

About the buyer

Swansea University is a public sector buyer in United Kingdom publishing tenders and awards on Stotles. Explore their procurement activity and find more opportunities like this one.

Relevant CPV codes

  • 38000000 · Laboratory, optical and precision equipments (excl. glasses)

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Decision makers

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