Closed tender

Optical Fiber Array and Micro-lens Packaging Equipment

Details

Topic
Microelectronic machinery and apparatus and microsystems
Published
13 September 2021
Submission
13 October 2021

Tender description

The photonic Packaging Group and the Tyndall Institute is seeking to purchase equipment to package optical components, specifically optical fibre and micro-optical components to photonic devices such as Photonic Integrated Circuits (PICs). These PIC devices include Silicon (Si), Indium Phosphide (InP) and Silicon Nitride (SiN) type photonic devices.

Timeline

  1. Completed: Tender published13 September 2021
    Current notice
  2. Completed: Submission date13 October 2021

About the buyer

University College Cork (UCC) is a public sector buyer in Ireland publishing tenders and awards on Stotles. Explore their procurement activity and find more opportunities like this one.

Relevant CPV codes

  • 31712000 · Microelectronic machinery and apparatus and microsystems
  • 31712100 · Microelectronic machinery and apparatus
  • 38000000 · Laboratory, optical and precision equipments (excl. glasses)
  • 42921320 · Packaging machines

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Decision makers

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