UCC - High Performance Focussed Ion Beam Milling Capability

Tender description

The Specialty Products and Services Centre (SP&S) at Tyndall National Institute, UCC, carry out analysis on a wide variety of Semiconductor devices, ranging from traditional Silicon microelectronics and Silicon MEMS to III-V photonic devices. We wish to extend our capability in the area of focussed ion beam (which can encompass Gallium beam/plasma/laser milling or a combination thereof) by purchasing a fully functional load locked system including pumps which will allow us to move our processing to a higher TRL level in terms of substrate size, milling speed and quality of lamella preparation. As much of the work is in the area of Semiconductor R&D we have a requirement for a system that can handle substrates of varying sizes from 0.3x0.3 mm and various irregular shaped pieces through to full wafers which could include wafers ranging in size from 50mm, 100mm, 150mm and 200mm wafers. The tender response must clearly show the costs for all items and any additional options must be clearly identified as such and costed separately.