Provision of a 200mm Wafer Capable Rapid Thermal Anneal (RTA) Tool

Tender description

The Zepler Institute Nanofabrication Facility cleanroom has identified a need to procure a RTA (Rapid Thermal Anneal) tool that is capable of processing 200mm wafers under a hydrogen ambient. This tool will support future research in the Nanofabrication Cleanroom Facility and in particular the strategic area of Silicon photonics. The acquisition of this equipment will support the facility's transition towards being fully 200mm wafer capable. The system must be delivered, commissioned and successfully pass user acceptance testing as per the requirements set out in Appendix 1(Specification) of this File 2 (Invitation to Tender) Document. A warranty with a minimum period of 12 months (including parts, labour and onsite engineer visits) must be included as part of the proposal. Onsite commissioning, user acceptance testing, user training and any associated costs must be detailed as part of the proposal, additional costs should be included for information purposes only in the commercial requirements response document. Shipping / delivery of the equipment to the University must be DDP incoterm (Inc Delivery, Duty, Insurance and VAT).