Electromechanical equipment

Tender description

The Compound Semiconductor Applications (CSA) Catapult is creating a modular, flexible, accelerated prototype package assembly and test facility for RF, photonics, and power compound semiconductor devices, modules and systems. The facility enables research, proof of concept and provides the capability to demonstrate the feasibility and undertake small volume prototype builds. High-resolution X-ray equipment with CT scan capability is required the routine microelectronics assembly verification, optimisation of interconnect layers, finding buried defects and failure analysis for developing a reliable and quality integration process. The manufacturer/authorised vendor shall install the system at the Innovation Centre, CSA Catapult, by March 2021. Scope The Compound Semiconductor Applications (CSA) Catapult is creating a modular, flexible, accelerated prototype package assembly and test facility for RF, photonics, and power compound semiconductor devices, modules and systems. The facility enables research, proof of concept and provides the capability to demonstrate the feasibility and undertake small volume prototype builds. As part of the package assembly research and development methodology, we require advanced non-destructive metrology tools that support in-line process optimisation, product development and quality assurance of complex fine-pitch 3D packaging architectures. High-resolution X-ray equipment with CT scan capability is required the routine microelectronics assembly verification, optimisation of interconnect layers, finding buried defects and failure analysis for developing a reliable and quality integration process. The typical application involves X-ray imaging of wire bonds, die bonds, PCB and flip-chip assembly interconnects. The computerised tomography (CT) option integrated with X-ray system will be used for 3D imaging, 3D metrology of embedded structures, 3D model reconstruction, virtual micro sectioning and complete visualisation of the defects. Capability to have optional upgrades, such as heated sample holders are beneficial for advanced analysis of the interconnects. The manufacturer/authorised vendor shall install the system at the Innovation Centre, CSA Catapult, within the advanced packaging laboratory, which will be equipped with access to all power and services for full installation and operation and be used to support contract research and development or commercial opportunities within the UK. The manufacturer/authorised vendor is also responsible for providing necessary training, warranty and service/maintenance support. System outline The system architecture is expected to be a standalone machine with a number of modules and tool options to allow the imaging and failure analysis of electronics micro assembly. The system shall provide a user-controlled interface for the imaging of microelectronics devices and modules for RF, photonics and power packaging. The system should have the capability to be used for both prototype device and low volume production quantities. The system shall be easy to configure and change for the user to allow different processes. A system solution is required that is flexible and upgradeable in the future. Additional module options can then be purchased based on changing industry trends or specific requirements from customers or partners for technology development. The system should also include user software, installation, and training. Additional Information The estimated budget range for the contract is GBP 300 000-GBP 400 000. The budget for the base system and additional tooling is expected to be a maximum of GBP 300 000, with the estimated maximum value covering related future services and options. The Catapult may not be able to purchase the entire system at once, so it is requested that the quotation is itemised with base system price and optional items. The manufacturer/authorised vendor shall install the system at the Innovation Centre, CSA Catapult, by March 2021.