Milling machines

Tender description

A system that enables precise thinning of silicon die of integrated circuits. The system must allow the user to accurately control the thickness of the resulting die within a few microns. The silicone is required to be thinned uniformly to give a consistent thickness across the device whilst keeping the Device under test (DUT) electronically functional. The supply and installation of a milling/grinding/polishing system that can thin the silicon die on semiconductor integrated circuits, while keeping the Device under test (DUT) electronically functional.