Bond Tester

Tender description

The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build. As part of the package assembly research and development methodology we require a machine to perform die bonding on to package, module and PCB boards. The bond test system shall allow the CSA Catapult to perform in-house measurements of die bonded (bonding of a chip to a substrate using a variety of attachment techniques) and wire bonded (mechanically attached wires to connect the chip and substrate) prototype samples. The equipment is intended to provide results of the bonded interface as the quality of the bond is an indicator of the overall mechanical quality of a part. The system shall also be capable of testing for adhesion strength, stress and strain capability of new materials over a range of low to high temperature applications. This will be used for all required package architectures required for Photonics, Power, and RF, e.g. standard industry package units; multi-chip modules and System-in-Package solutions involving introduction of novel material properties. The system will be in the CSA Catapults Innovation Centre, within the Advanced Packaging Laboratory, which will be equipped with access to all power and services for full installation and operation. The Catapult may also purchase additional, related services. Additional information: To express interest in this opportunity and receive the tender documents, please email procurement@csa.catapult.org.uk with ITC-2019-028 in the subject field.