Laboratory, optical and precision equipments (excl. glasses)
Details
- Supplier(s)
- Accelonix Ltd
- Value
- GBP 169,000
- Topic
- Laboratory, optical and precision equipments (excl. glasses)
- Published
- 26 July 2019
- Source
- TedNotices
Tender description
The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, photonics, and power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build. As part of the package assembly research and development methodology we require a machine to perform wire bonding from chips and modules on to substrates and PCB boards. The wire bonding equipment shall allow manual and automated bonding for experimentation and low volume prototype volume build. It shall be adaptable to wire bond a wide variety of components from chip level through to module level using organic-inorganics substrates and PCBs for all required package architecture required for photonics, power, and RF, e.g. standard industry package units; multi-chip modules and system-in-package solutions. The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, photonics, and power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build. As part of the package assembly research and development methodology we require a machine to perform wire bonding from chips and modules on to substrates and PCB boards. The wire bonding equipment shall allow manual and automated bonding for experimentation and low volume prototype volume build. It shall be adaptable to wire bond a wide variety of components from chip level through to module level using organic-inorganics substrates and PCBs for all required package architecture required for photonics, power, and RF, e.g. standard industry package units; multi-chip modules and System-in-Package solutions. The system will be in the CSA Catapults Innovation Centre, within the advanced packaging laboratory, which will be equipped with access to all power and services for full installation and operation. The Catapult may also purchase additional, related services.
Timeline
- Completed: Award date26 June 2019
- Completed: Award published26 July 2019Current notice
About the buyer
COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED is a public sector buyer in United Kingdom publishing tenders and awards on Stotles. Explore their procurement activity and find more opportunities like this one.
Relevant CPV codes
- 38000000 · Laboratory, optical and precision equipments (excl. glasses)
Decision makers
Connect with the people behind this procurement.
| Contact name | Job title | Phone number | Work email |
|---|---|---|---|
| Head of Procurement | +44 •••• •••••• | ••••••••@compound-semiconductor-applications-catapult-limited.gov | |
| Commercial Director | +44 •••• •••••• | ••••••••@compound-semiconductor-applications-catapult-limited.gov | |
| Procurement Manager | +44 •••• •••••• | ••••••••@compound-semiconductor-applications-catapult-limited.gov | |
| Category Lead | +44 •••• •••••• | ••••••••@compound-semiconductor-applications-catapult-limited.gov | |
| Senior Buyer | +44 •••• •••••• | ••••••••@compound-semiconductor-applications-catapult-limited.gov | |
| Contracts Manager | +44 •••• •••••• | ••••••••@compound-semiconductor-applications-catapult-limited.gov |
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