Laboratory, optical and precision equipments (excl. glasses)

Tender description

CPI is looking to expand their roll to roll device integration capabilities to meet technology demands by upgrading the current TAL15k multi-component line. The tool comprises of several modules which combine to produce reels of functional inlays and circuits on flexible polymer films. The upgrades will need to integrate seemlessly with the current modules and software to enhance the tools capability. The upgrades are divided into 7 lots which bidders can bid for all or combination of lots as appropriate. CPI purchased the current tool in order to integrate flexible IC devices and small SMD to produce functional inlays at high throughput for various technologies (RFID, NFC etc.). The current and future demand of these inlays have added complexity requiring silicon IC’s, RGB LED’s and power sources (flexible batteries, super capacitors), along with some requirements for high density component circuits. In order to satisfy this demand the current tool requires multiple upgrades as defined in the Procurement pack. CPI purchased the current tool in order to integrate flexible IC devices and small SMD to produce functional inlays at high throughput for various technologies (RFID, NFC etc.). The current and future demand of these inlays have added complexity requiring silicon IC’s, RGB LED’s and power sources (flexible batteries, super capacitors), along with some requirements for high density component circuits. In order to satisfy this demand the current tool requires multiple upgrades as defined in the Procurement pack. CPI purchased the current tool in order to integrate flexible IC devices and small SMD to produce functional inlays at high throughput for various technologies (RFID, NFC etc.). The current and future demand of these inlays have added complexity requiring silicon IC’s, RGB LED’s and power sources (flexible batteries, super capacitors), along with some requirements for high density component circuits. In order to satisfy this demand the current tool requires multiple upgrades as defined in the Procurement pack. CPI purchased the current tool in order to integrate flexible IC devices and small SMD to produce functional inlays at high throughput for various technologies (RFID, NFC etc.). The current and future demand of these inlays have added complexity requiring silicon IC’s, RGB LED’s and power sources (flexible batteries, super capacitors), along with some requirements for high density component circuits. In order to satisfy this demand the current tool requires multiple upgrades as defined in the Procurement pack. CPI purchased the current tool in order to integrate flexible IC devices and small SMD to produce functional inlays at high throughput for various technologies (RFID, NFC etc.). The current and future demand of these inlays have added complexity requiring silicon IC’s, RGB LED’s and power sources (flexible batteries, super capacitors), along with some requirements for high density component circuits. In order to satisfy this demand the current tool requires multiple upgrades as defined in the Procurement pack. CPI purchased the current tool in order to integrate flexible IC devices and small SMD to produce functional inlays at high throughput for various technologies (RFID, NFC etc.). The current and future demand of these inlays have added complexity requiring silicon IC’s, RGB LED’s and power sources (flexible batteries, super capacitors), along with some requirements for high density component circuits. In order to satisfy this demand the current tool requires multiple upgrades as defined in the Procurement pack. Electronical in line Testing mixed signal