Provision of a Wafer Level Electroplating Unit

Tender description

The Zepler Institute (ZI), University of Southampton, plans to purchase a wafer level-electroplating tool for use in state of the art wafer scale fabrication research. The tool is intended to perform Back-end-of-line wafer fabrication processes and research including the fabrication of interconnects and Through Silicon Vias. Additional uses of the tool to undertake wafer scale packaging processes is highly desirable. The fabrication facility offers industry-compatible fabrication processing including 150mm and 200mm wafer processing and the tool needs to offer comparable plating performance to commercial foundry processes. The tool is not required to provide fully automated or high volume throughput and processing can be undertaken on a single wafer-by-wafer basis. There is no current requirement for wafer loading from wafer carriers. The tool is not intended for continuous operations and will have periods of idle or standby.