Miscellaneous engineering services

Tender description

Multilot framework to include PCB Layout and Production, Optical Design and Manufacture, Firm and software development, System and Mechanical Prototyping. Lot 1 PCB Layout We would require that PCB designs are created from circuit schematics. The circuit schematics might be of high speed/high bandwidth photodetectors, digital interconnects between microprocessors/ADCs/DACs/FPGAs etc., low noise power supplies, high linearity/high bandwidth LED/LASER driver circuits etc. The expertise required would be that of high speed, high bandwidth design focused on signal integrity. We are looking for designs that can support SNR levels of 30+ dB. The PCB layouts referred to in Lot 1 would be manufactured and (less often) populated. We are looking for quality over quantity, as well as capability for rigid and flexible PCBs ideally, with focus on rigid ones. We would be manufacturing small number of prototypes for each design, but potentially a medium volume of different prototypes every month. Lot 3: Optical Component Design and Manufacture We are looking for subsystem delivery. What that means is multi-component optical systems that achieve given parameters. Preferably delivered in a custom mounting solution that works for our particular use. Lot 4: Engineering Resources for Firmware/Software Development We are looking to have ad-hoc use of engineers to work on projects as required. In particular we are looking for analogue designers, opto-electronic engineers, firmware engineers and software engineers. The analogue designers would have to be experienced in low noise circuits, high bandwidth circuits, and/or digital signal processing platforms. The opto-electronic engineers would be experienced in high speed optical detectors, high sensitivity optical detectors, and low noise optical detectors. The firmware engineers would be experienced in signal processing communication applications, low level driver/interface support for Ethernet, USB etc. The software engineers would also preferably have experience in communications, and be able to build the upper layers of the communication stack for use with LiFi. On occasion we might need software engineers specialized in developing applications for mobile platforms i.e. iOS, Android etc. Lot 5: Firmware/Software Development Firmware and software would need to be developed to support our platform development. As part of that higher layers of the communication protocol stack would need be implemented/adapted for use with lower PHY and MAC layers developed internally. Device drivers to enable support of our developed platforms on a variety of OSs would need implemented as well. Application specific software would also be required in order to enable demonstrator functionality as well. Lot 6: LiFi System Prototyping Complete LiFi system prototyping based on a defined system architecture and performance specification might be required. Capability spanning all other lots would be required in order to deliver satisfactory results. Lot 7: Mechanical Prototyping Mechanical design and manufacturing work will be required for enclosure design, as well as optics mounting apparatus. The work will span system design, 3D printing, as well as precision (order of 0.1 mm accuracy, which should be relatively straightforward) component manufacturing. We would require waterproof enclosures as well as weatherproof ones in addition to more traditional ones.