Awarded contract

Miscellaneous equipment

Details

Supplier(s)
ficonTEC GmbH
Value
EUR 542,000
Topic
Miscellaneous equipment
Published
10 July 2017

Tender description

The Photonic Packaging Group at the Tyndall National Institute, University College Cork is seeking to purchase a High Accuracy Photonic Flipchip Packaging and Assembly piece of equipment. The purpose of the equipment is to support the development and fabrication of fully assembled photonic prototypes. The Photonic Packaging Group at the Tyndall Institute, University College Cork is seeking to purchase a High Accuracy Photonic Flipchip Packaging and Assembly piece of equipment. The purpose of the equipment is to support the development and fabrication of fully assembled photonic prototypes.

Timeline

  1. Completed: Award date1 March 2017
  2. Completed: Award published10 July 2017
    Current notice

About the buyer

University College Cork (UCC) is a public sector buyer in Ireland publishing tenders and awards on Stotles. Explore their procurement activity and find more opportunities like this one.

Relevant CPV codes

  • 39300000 · Miscellaneous equipment
  • 42921320 · Packaging machines

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