Laboratory, optical and precision equipments (excl. glasses)

Tender description

PURCH1486 Provision of an automated sub-micron fine-pitch flip-chip bonding machine. Tender documents available from Public Contracts Scotland. Tender returns should be submitted via Public Contracts Scotland, no paper copies will be accepted. Should paper tenders be submitted, they will be rejected. Further to this any questions or communications regarding individual tender exercises must be sent via the Public Contracts Scotland Portal. Tender queries received through any other channel will not be answered. Should users of Public Contracts Scotland have any problems with the web site they should contact website Support Desk, contact details can be found by following the ‘Contact Us’ option on the left hand menu at http://www.publiccontractsscotland.gov.uk/default.aspx The University of Glasgow is tendering for an automated sub-micron fine-pitch flip-chip bonding machine, including all required calibration parts and certificates. The machine must perform face-to-face bonding of die, i.e. flip-chip bonding.