Printed-Circuit-Board (PCB) Manufacturing Equipment

Tender description

Scope of Requirement 1.1 A multi-layer press 1.1.1 To enable us to produce PCBs with more than two layers 1.2 A semi-automatic pick and place machine 1.2.1 To assemble PCBs with 0201 passives and fine-pitch ICs 1.3 Application of solder resist and idents to PCBs 1.3.1 To provide a protective coating and resistive layer to the outside layers of PCBs, and to enable the location of the components to be marked onto the PCBs. 1.4 A reflow oven 1.4.1 To allow the assembly of PCBs which contain components impossible to otherwise solder, whilst improving assemble efficiency 1.5 Application of through-hole plating 1.5.1 To provide a method of plating the inside of holes without the use of chemical tanks.