Closed tender

GB-LIVERPOOL: Manual Die Placement System for Glueing & Bump Bonding

Details

Value
GBP 300,000
Topic
Laboratory, optical and precision equipments (excl. glasses)
Published
7 January 2016
Submission
19 January 2016

Tender description

Tender for the supply of a die bonding system suitable for the glueing of silicon dies with epoxy and filled anisotropically conductive glues as well as for bump bonding with Indium, PbZn and AgZn solder balls. The system will be housed in the Liverpool Semiconductor Detector Centre (LSDC), Department of Physics, University of Liverpool.

Timeline

  1. Completed: Tender published7 January 2016
    Current notice
  2. Completed: Submission date19 January 2016

About the buyer

University of Liverpool is a public sector buyer in United Kingdom publishing tenders and awards on Stotles. Explore their procurement activity and find more opportunities like this one.

Relevant CPV codes

  • 38000000 · Laboratory, optical and precision equipments (excl. glasses)

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