Scanning Acoustic Microscope Imaging System

Tender description

Tyndall National Institute, University College Cork wishes to procure a Scanning Acoustic Microscope (SAM) to enable non-destructive analysis and imaging of a range of electronic component samples. These will range from standard plastic- encapsulated integrated circuits to advanced novel structures involving bonded silicon, glass and quartz wafers. The system will be used in an off-line research / analytical laboratory, so high volume sample throughput will not be required. However, the system will be required to be equipped with a suitable range of transducers to allow the highest possible resolution imaging of the types of sample outlined above.